The reliability of soldered joints produced at a low temperature

Abstract

Under severe service conditions of electronic instruments (at elevated temperatures and vibrations in electronic systems), failures in their operation frequently occur. Severe intrinsic thermal conditions of operating instruments may cause such failures. However, malfunctions in electronic devices may often be due to defects in soldered joints that were made at lowered temperatures. An approach is proposed that makes it possible to considerably improve the reliability of soldered joints. © 2013 Pleiades Publishing, Ltd.