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http://elar.urfu.ru/handle/10995/27487
Title: | The development of the physical fundamentals of contact soldering as a factor for reducing the number of defects in electronic devices |
Authors: | Shtennikov, V. N. Budai, B. T. |
Issue Date: | 2013 |
Citation: | Shtennikov V. N. The development of the physical fundamentals of contact soldering as a factor for reducing the number of defects in electronic devices / V. N. Shtennikov, B. T. Budai // Russian Journal of Nondestructive Testing. — 2013. — Vol. 49. — № 3. — P. 178-183. |
Abstract: | Automated control systems employ electronic components that are connected with a printed circuit board (PCB) by soldered joints. At elevated temperatures and with high vibration levels, soldering defects may occur that are characterized by the deterioration or complete loss of contact with the PCB, which can lead to the failure of the system. In this work, an approach is proposed to considerably improve the reliability of soldered joints. © 2013 Pleiades Publishing, Ltd. |
Keywords: | COMPARISON DEFECT DIAGNOSTICS HEAT TRANSFER QUALITY SOLDERING AUTOMATED CONTROL SYSTEMS COMPARISON ELECTRONIC COMPONENT ELECTRONIC DEVICE ELEVATED TEMPERATURE PRINTED CIRCUIT BOARDS (PCB) VIBRATION LEVEL DEFECTS HEAT TRANSFER IMAGE QUALITY ORGANIC POLLUTANTS PLASMA DIAGNOSTICS SOLDERED JOINTS SOLDERING |
URI: | http://elar.urfu.ru/handle/10995/27487 |
SCOPUS ID: | 84879292647 |
WOS ID: | 000320475200007 |
PURE ID: | 912570 |
ISSN: | 1061-8309 |
DOI: | 10.1134/S1061830913030078 |
Appears in Collections: | Научные публикации ученых УрФУ, проиндексированные в SCOPUS и WoS CC |
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scopus-2013-0633.pdf | 820,44 kB | Adobe PDF | View/Open |
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