Please use this identifier to cite or link to this item: http://hdl.handle.net/10995/27487
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dc.contributor.authorShtennikov, V. N.en
dc.contributor.authorBudai, B. T.en
dc.date.accessioned2014-11-29T19:47:44Z-
dc.date.available2014-11-29T19:47:44Z-
dc.date.issued2013-
dc.identifier.citationShtennikov V. N. The development of the physical fundamentals of contact soldering as a factor for reducing the number of defects in electronic devices / V. N. Shtennikov, B. T. Budai // Russian Journal of Nondestructive Testing. — 2013. — Vol. 49. — № 3. — P. 178-183.en
dc.identifier.issn1061-8309-
dc.identifier.other1good_DOI
dc.identifier.otherd1d401db-f9c0-45eb-8ea4-365905401282pure_uuid
dc.identifier.otherhttp://www.scopus.com/inward/record.url?partnerID=8YFLogxK&scp=84879292647m
dc.identifier.urihttp://hdl.handle.net/10995/27487-
dc.description.abstractAutomated control systems employ electronic components that are connected with a printed circuit board (PCB) by soldered joints. At elevated temperatures and with high vibration levels, soldering defects may occur that are characterized by the deterioration or complete loss of contact with the PCB, which can lead to the failure of the system. In this work, an approach is proposed to considerably improve the reliability of soldered joints. © 2013 Pleiades Publishing, Ltd.en
dc.format.mimetypeapplication/pdfen
dc.language.isoenen
dc.sourceRussian Journal of Nondestructive Testingen
dc.subjectCOMPARISONen
dc.subjectDEFECTen
dc.subjectDIAGNOSTICSen
dc.subjectHEAT TRANSFERen
dc.subjectQUALITYen
dc.subjectSOLDERINGen
dc.subjectAUTOMATED CONTROL SYSTEMSen
dc.subjectCOMPARISONen
dc.subjectELECTRONIC COMPONENTen
dc.subjectELECTRONIC DEVICEen
dc.subjectELEVATED TEMPERATUREen
dc.subjectPRINTED CIRCUIT BOARDS (PCB)en
dc.subjectVIBRATION LEVELen
dc.subjectDEFECTSen
dc.subjectHEAT TRANSFERen
dc.subjectIMAGE QUALITYen
dc.subjectORGANIC POLLUTANTSen
dc.subjectPLASMA DIAGNOSTICSen
dc.subjectSOLDERED JOINTSen
dc.subjectSOLDERINGen
dc.titleThe development of the physical fundamentals of contact soldering as a factor for reducing the number of defects in electronic devicesen
dc.typeArticleen
dc.typeinfo:eu-repo/semantics/publishedVersionen
dc.typeinfo:eu-repo/semantics/articleen
dc.identifier.doi10.1134/S1061830913030078-
dc.identifier.scopus84879292647-
local.affiliationEl'Tsin Ural Federal University, Yekaterinburg, Russian Federationen
local.affiliationPhysico-Technical Institute, El'Tsin Ural Federal University, Yekaterinburg, Russian Federationen
local.contributor.employeeШтенников Василий Николаевичru
local.contributor.employeeБудаи Борис Тиборовичru
dc.identifier.wos000320475200007-
local.contributor.departmentИнститут радиоэлектроники и информационных технологий - РтФru
local.contributor.departmentФизико-технологический институтru
local.identifier.pure912570-
local.identifier.eid2-s2.0-84879292647-
local.identifier.wosWOS:000320475200007-
Appears in Collections:Научные публикации, проиндексированные в SCOPUS и WoS CC

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