Please use this identifier to cite or link to this item: http://hdl.handle.net/10995/27487
Title: The development of the physical fundamentals of contact soldering as a factor for reducing the number of defects in electronic devices
Authors: Shtennikov, V. N.
Budai, B. T.
Issue Date: 2013
Citation: Shtennikov V. N. The development of the physical fundamentals of contact soldering as a factor for reducing the number of defects in electronic devices / V. N. Shtennikov, B. T. Budai // Russian Journal of Nondestructive Testing. — 2013. — Vol. 49. — № 3. — P. 178-183.
Abstract: Automated control systems employ electronic components that are connected with a printed circuit board (PCB) by soldered joints. At elevated temperatures and with high vibration levels, soldering defects may occur that are characterized by the deterioration or complete loss of contact with the PCB, which can lead to the failure of the system. In this work, an approach is proposed to considerably improve the reliability of soldered joints. © 2013 Pleiades Publishing, Ltd.
Keywords: COMPARISON
DEFECT
DIAGNOSTICS
HEAT TRANSFER
QUALITY
SOLDERING
AUTOMATED CONTROL SYSTEMS
COMPARISON
ELECTRONIC COMPONENT
ELECTRONIC DEVICE
ELEVATED TEMPERATURE
PRINTED CIRCUIT BOARDS (PCB)
VIBRATION LEVEL
DEFECTS
HEAT TRANSFER
IMAGE QUALITY
ORGANIC POLLUTANTS
PLASMA DIAGNOSTICS
SOLDERED JOINTS
SOLDERING
URI: http://hdl.handle.net/10995/27487
SCOPUS ID: 84879292647
WOS ID: 000320475200007
PURE ID: 912570
ISSN: 1061-8309
DOI: 10.1134/S1061830913030078
Appears in Collections:Научные публикации, проиндексированные в SCOPUS и WoS CC

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