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|Title:||The development of the physical fundamentals of contact soldering as a factor for reducing the number of defects in electronic devices|
|Authors:||Shtennikov, V. N.|
Budai, B. T.
|Citation:||Shtennikov V. N. The development of the physical fundamentals of contact soldering as a factor for reducing the number of defects in electronic devices / V. N. Shtennikov, B. T. Budai // Russian Journal of Nondestructive Testing. — 2013. — Vol. 49. — № 3. — P. 178-183.|
|Abstract:||Automated control systems employ electronic components that are connected with a printed circuit board (PCB) by soldered joints. At elevated temperatures and with high vibration levels, soldering defects may occur that are characterized by the deterioration or complete loss of contact with the PCB, which can lead to the failure of the system. In this work, an approach is proposed to considerably improve the reliability of soldered joints. © 2013 Pleiades Publishing, Ltd.|
AUTOMATED CONTROL SYSTEMS
PRINTED CIRCUIT BOARDS (PCB)
|Appears in Collections:||Научные публикации, проиндексированные в SCOPUS и WoS CC|
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