Optimization of the required temperature of contact soldering of electronic devices

Please use this identifier to cite or link to this item: http://elar.urfu.ru/handle/10995/27309

Title:	Optimization of the required temperature of contact soldering of electronic devices
Authors:	Shtennikov, V. N. Seleznev, V. D.
Issue Date:	2013
Citation:	Shtennikov V. N. Optimization of the required temperature of contact soldering of electronic devices / V. N. Shtennikov, V. D. Seleznev // Journal of Engineering Physics and Thermophysics. — 2013. — Vol. 86. — № 5. — P. 1060-1065.
Abstract:	This paper presents the results of a complex of experimental and theoretical studies aimed at improving the quality of soldering electronic devices by optimizing the design-technological parameters. © 2013 Springer Science+Business Media New York.
Keywords:	DEVICES ENGINEERING PHYSICS HEAT CONDUCTION SOLDERING TEMPERATURE TIME DEVICES ELECTRONIC DEVICE ENGINEERING PHYSICS THEORETICAL STUDY TIME HEAT CONDUCTION OPTIMIZATION TEMPERATURE THERMOELECTRIC EQUIPMENT SOLDERING
URI:	http://elar.urfu.ru/handle/10995/27309
SCOPUS ID:	84888053660
WOS ID:	000218774500010
PURE ID:	869988
ISSN:	1062-0125 1573-871X
DOI:	10.1007/s10891-013-0928-6
Appears in Collections:	Научные публикации ученых УрФУ, проиндексированные в SCOPUS и WoS CC

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