Annealing effect on temperature stability and mechanical stress at the “CdxPb1−xS film — substrate” interface

Abstract

The article establishes the upper temperature steadiness limit of СdxPb1‑xS supersaturated solid solutions obtained by chemical bath deposition. СdxPb1‑xS (x = 0.06; 0.122; 0.176) and (x = 0.02–0.05) films remained stable under the heating up to 405– 410 and 450 K, respectively. SEM studies have shown that heating of СdxPb1‑xS films (x = 0.02–0.05) to 620 K leads to the structure destruction. Internal mechanical compressive stresses at the “СdxPb1‑xS film-substrate” interface was calculated in the range of 300–900 K for the first time ever, the highest values reached 2000–2750 kN/m2 for a number of the films compositions. In contrast to solid solutions, the expansion stresses up to 100 kN/m2 were derived for the CdS layer at 900 K. The obtained temperature steadiness boundaries and the mechanical stresses of СdxPb1‑xS films must be taken into account in the development of photonic devices based on such materials.