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Title: | Influence of copper intercalation on the resistive state of compounds in the Cu-HfSe2 system |
Authors: | Pleshchev, V. G. Selezneva, N. V. Baranov, N. V. |
Issue Date: | 2012 |
Publisher: | Springer Science and Business Media LLC |
Citation: | Pleshchev V. G. Influence of copper intercalation on the resistive state of compounds in the Cu-HfSe2 system / V. G. Pleshchev, N. V. Selezneva, N. V. Baranov // Physics of the Solid State. — 2012. — Vol. 54. — № 4. — P. 716-721. |
Abstract: | Polycrystalline samples of intercalated compounds Cu xHfSe 2 have been synthesized for the first time and their electrical resistivity has been measured at both direct current and alternating current (with a frequency ranging from 200 Hz to 150 kHz) in the temperature range 80-300 K. It has been shown that the intercalation of copper atoms between three-layer Se-Hf-Se blocks leads to an increase in the electrical resistivity of the samples, as well as to a more pronounced activated character of the temperature dependence of the electrical resistivity. A time dependence of the electrical resistivity of the Cu xHfSe 2 samples at room temperature, which is associated with the presence of copper ions in the sample, has been determined. © 2012 Pleiades Publishing, Ltd. |
URI: | http://elar.urfu.ru/handle/10995/50989 |
SCOPUS ID: | 84859816443 |
WOS ID: | 000302961900007 |
PURE ID: | 1085558 |
ISSN: | 1063-7834 1090-6460 |
DOI: | 10.1134/S1063783412040221 |
Appears in Collections: | Научные публикации ученых УрФУ, проиндексированные в SCOPUS и WoS CC |
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