Please use this identifier to cite or link to this item: http://hdl.handle.net/10995/35424
Title: Simulation of an electrolytic bath for electrodeposition of multilayer shielding coatings
Authors: Dolmatova, E. A.
Dayanov, A. D.
Ostanina, T. N.
Issue Date: 2015
Publisher: Уральский федеральный университет
Citation: Долматова Е. А. Simulation of an electrolytic bath for electrodeposition of multilayer shielding coatings / Е. А. Долматова, А. Д. Даянов, Т. Н. Останина // Chimica Techno Acta. — 2015. — Vol. 2. № 3. — С. 200-203.
Abstract: In this the calculation work galvanic bath of Cu/(Ni+Cu) multilayer shielding coatings formation from an acetate electrolyte containing 0,03 mol/L of CuAc2, 0,3 mol/L of NiAc2 and 1,66 mol/L of acetic acid were made. According to the results of polarization studies values of coatings deposition pulse mode current density have been chosen and current efficiency of copper and nickel during deposition of Cu-Ni alloy has been determined. To ensure a constant formulation of the electrolyte it has been proposed to use insoluble anodes made of stainless steel and continuous circulation of the electrolyte. The scheme of steams enabling the adjustment of the solution formulation with the use of an additional collecting vessel has been developed. The formulation of the correcting stream continuously fed into the collecting vessel has been calculated.
Keywords: ELECTROCHEMISTRY
SIMULATION
CUPRUM ACETATE
NICKEL ACETATE
MULTILAYER SHIELDING COATINGS
ЭЛЕКТРОХИМИЯ
МОДЕЛИРОВАНИЕ
АЦЕТАТ МЕДИ
АЦЕТАТ НИКЕЛЯ
ГАЛЬВАНИЧЕСКАЯ ВАННА
URI: http://hdl.handle.net/10995/35424
RSCI ID: https://elibrary.ru/item.asp?id=24982683
ISSN: 2409-5613 (Print)
2411-1414 (Online)
Other versions: http://hdl.handle.net/10995/35425
DOI: 10.15826/chimtech.2015.2.3.021
Origin: Chimica Techno Acta. 2015. Vol. 2. № 3.
Appears in Collections:Chimica Techno Acta

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