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|Title:||Application of surfacing using consumable electrode with an additional filler wire to ensure the required operational properties of pipeline valves|
|Authors:||Poloskov, S. S.|
Buzorina, D. S.
Erofeev, V. A.
|Publisher:||IOP Publishing Ltd|
|Citation:||Poloskov S. S. Application of surfacing using consumable electrode with an additional filler wire to ensure the required operational properties of pipeline valves / S. S. Poloskov, D. S. Buzorina, V. A. Erofeev // IOP Conference Series: Materials Science and Engineering. — 2020. — Vol. 966. — Iss. 1. — 12015.|
|Abstract:||A promising way to ensure the required operational properties of pipeline valves with a significant increase in productivity and quality of surfacing during its manufacture is the introduction of anti-corrosion surfacing technologies using a consumable electrode with the supply of an additional filler wire. A solution to the optimization problem of the proposed surfacing technology is complicated by a large number of its parameters, therefor the task was solved in stages. At the first stage, the parameters of the arc interaction between the electrode and filler wire was determined, and at the second - the specific features of the formation of the surfacing bath with such interaction. A virtual study of the process of surfacing with Inconel 625 wires in argon on steel 09G2S was carried out. The influence of the thermal effect of the deposition mode parameters on the main metal is determined. It has been established that, due to the fact that the heat flux in the main metal is created mainly by the droplet stream of the deposited metal from the main arc at high currents, the diameter of the electrode wire guaranteeing its burning should be larger than the filler wire. © Published under licence by IOP Publishing Ltd.|
|Conference name:||15th International Conference on Industrial Manufacturing and Metallurgy, ICIMM 2020|
|Conference date:||18 June 2020 through 19 June 2020|
|Appears in Collections:||Научные публикации, проиндексированные в SCOPUS и WoS CC|
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