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dc.contributor.authorJeong, Y. B.en
dc.contributor.authorWada, T.en
dc.contributor.authorJoo, S. -H.en
dc.contributor.authorPark, J. -M.en
dc.contributor.authorKim, H. S.en
dc.contributor.authorOkulov, I. V.en
dc.contributor.authorKim, K. B.en
dc.contributor.authorKato, H.en
dc.date.accessioned2022-05-12T08:26:32Z-
dc.date.available2022-05-12T08:26:32Z-
dc.date.issued2021-
dc.identifier.citationHierarchical Heterostructured FeCr–(Mg–Mg2Ni) Composite with 3D Interconnected and Lamellar Structures Synthesized by Liquid Metal Dealloying / Y. B. Jeong, T. Wada, S. -H. Joo et al. // Journal of Materials Research and Technology. — 2021. — Vol. 15. — P. 4573-4579.en
dc.identifier.issn2238-7854-
dc.identifier.otherAll Open Access, Gold3
dc.identifier.urihttp://elar.urfu.ru/handle/10995/111977-
dc.description.abstractLiquid metal dealloying (LMD) has recently attracted significant attention. Because the LMD process enables the production of three-dimensional (3D) interconnected non-noble metallic materials. In addition, the metallic melt medium is useful for the development of heterostructure (HS) metal–metal composites. However, the solidified liquid metal phase (low melting point metals such as Mg, Bi, Sn, or Cu) has a much lower strength than the developed ligament phase (e.g., Fe, FeCr, Ti, etc.). In this study, the soft Mg phase was strengthened by adding alloying element of Ni. A eutectic composition of Mg–10 at.% Ni melt leads to the formation of fine eutectic structure of (Mg–Mg2Ni) within 3D interconnected morphology. This hierarchical heterostructured composite consisted of FeCr ligament and Mg–Mg2Ni lamellar, and a high yield strength of 280 MPa and a noticeable elongation (1.5%) were achieved. The complex 3D morphology of ligament and lamellar geometrically constraint each other, and it prevents the early fracture of brittle Mg–Mg2Ni lamellar phase. The alloy design for the LMD melt gives insights for hierarchical HS materials with outstanding mechanical properties for structural applications. © 2021 The Authors.en
dc.description.sponsorshipThis work was supported by JSPS KAKENHI (Grant Number JP20J14001 ). Yeonbeom Jeong acknowledges the support from the GP-MS at Tohoku University . This work has supported by the National Research Foundation of Korea grant funded by the Korea government(MSIT) (No. NRF-2021R1C1C1007645 ). This work was primarily supported by a Grant-in-Aid for Scientific Research on Innovative Areas “Science of New-Class of Materials Based on Elemental Multiplicity and Heterogeneity (Grant No. 18H05452)” from the Ministry of Education, Culture, Sports, Science, and Technology (MEXT, Japan) (H.K and T.W). This work was performed under the ICC-IMR Program of the Institute for Materials Research, Tohoku University.en
dc.format.mimetypeapplication/pdfen
dc.language.isoenen
dc.publisherElsevier Editora Ltdaen1
dc.publisherElsevier BVen
dc.rightsinfo:eu-repo/semantics/openAccessen
dc.sourceJ. Mater. Res. Technol.2
dc.sourceJournal of Materials Research and Technologyen
dc.subjectHETEROSTRUCTURE COMPOSITESen
dc.subjectHIERARCHICAL STRUCTUREen
dc.subjectLIQUID METAL DEALLOYINGen
dc.subjectMECHANICAL PROPERTIESen
dc.subjectMETAL MATRIX COMPOSITESen
dc.subjectALLOYING ELEMENTSen
dc.subjectBINARY ALLOYSen
dc.subjectDEALLOYINGen
dc.subjectEUTECTICSen
dc.subjectIRON ALLOYSen
dc.subjectMAGNESIUM ALLOYSen
dc.subjectMETALLIC MATRIX COMPOSITESen
dc.subjectMETALSen
dc.subjectMORPHOLOGYen
dc.subjectDEALLOYINGen
dc.subjectHETEROSTRUCTURE COMPOSITEen
dc.subjectHIERARCHICAL STRUCTURESen
dc.subjectLIQUID METAL DEALLOYINGen
dc.subjectLOW MELTING POINTen
dc.subjectMETAL PHASEen
dc.subjectMETAL-METAL COMPOSITESen
dc.subjectMETALLIC MATERIALen
dc.subjectMETALLIC MELTSen
dc.subjectSYNTHESISEDen
dc.subjectLIQUID METALSen
dc.titleHierarchical Heterostructured FeCr–(Mg–Mg2Ni) Composite with 3D Interconnected and Lamellar Structures Synthesized by Liquid Metal Dealloyingen
dc.typeArticleen
dc.typeinfo:eu-repo/semantics/articleen
dc.typeinfo:eu-repo/semantics/publishedVersionen
dc.identifier.rsi47520590-
dc.identifier.doi10.1016/j.jmrt.2021.10.080-
dc.identifier.scopus85118200068-
local.contributor.employeeJeong, Y.B., Department of Materials Science, Graduate School of Engineering, Tohoku University, Japan; Wada, T., Institute for Materials Research, Tohoku University, Japan; Joo, S.-H., Institute for Materials Research, Tohoku University, Japan, Department of Materials Science and Engineering, Dankook University, 119 Dandae-ro, Cheonan, 31116, South Korea; Park, J.-M., Pohang University of Science and Technology, South Korea; Kim, H.S., Pohang University of Science and Technology, South Korea; Okulov, I.V., Institute of Natural Sciences and Mathematics, Ural Federal University, Ekaterinburg, 620000, Russian Federation, Leibniz Institute for Materials Engineering-IWT, Badgasteiner Str. 3, Bremen, 28359, Germany, Faculty of Production Engineering, University of Bremen, Badgasteiner Str. 1, Bremen, 28359, Germany; Kim, K.B., Department of Nanotechnology and Advanced Materials Engineering, Sejong University, South Korea; Kato, H., Institute for Materials Research, Tohoku University, Japanen
local.description.firstpage4573-
local.description.lastpage4579-
local.volume15-
dc.identifier.wos000717662900004-
local.contributor.departmentDepartment of Materials Science, Graduate School of Engineering, Tohoku University, Japan; Institute for Materials Research, Tohoku University, Japan; Department of Materials Science and Engineering, Dankook University, 119 Dandae-ro, Cheonan, 31116, South Korea; Pohang University of Science and Technology, South Korea; Institute of Natural Sciences and Mathematics, Ural Federal University, Ekaterinburg, 620000, Russian Federation; Leibniz Institute for Materials Engineering-IWT, Badgasteiner Str. 3, Bremen, 28359, Germany; Faculty of Production Engineering, University of Bremen, Badgasteiner Str. 1, Bremen, 28359, Germany; Department of Nanotechnology and Advanced Materials Engineering, Sejong University, South Koreaen
local.identifier.pure28888667-
local.identifier.eid2-s2.0-85118200068-
local.identifier.wosWOS:000717662900004-
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