Please use this identifier to cite or link to this item:
Title: The study of TIM polymer composite materials thermal conductivity
Authors: Zemlyanskaya, A. P.
Shishkin, R. A.
Kudyakova, V. S.
Yuferov, Y. V.
Zykov, F. M.
Issue Date: 2019
Publisher: American Institute of Physics Inc.
Citation: The study of TIM polymer composite materials thermal conductivity / A. P. Zemlyanskaya, R. A. Shishkin, V. S. Kudyakova, et al. — DOI 10.1063/1.5134342 // AIP Conference Proceedings. — 2019. — Vol. 2174. — 020191.
Abstract: A recent trend in electronic technology deals with a sharp performance increase within decrease dimensions and mass of devices. High-performance thermal interface materials (TIM) primarily thermal pastes are indispensable to application. A number of filler materials: ceramics (aluminum nitride, silicon carbide, alumina) metals (aluminum, copper) and graphite were considered to apply. The data containing average particles size, specific surface area, and maximal volume and mass fraction for various materials was obtained. The thermal conductivity of samples with aluminum and graphite dramatically exceed values obtained within mathematical models' calculation. The highest thermal conductivity values were obtained for SiC (1.37 W/(m·K)), AlN (1.09 W/(m·K)), C (2.85 W/(m·K)) and Al (1.20 W/(m·K)), that mad the mentioned above materials the most promising for high-performance thermal pastes. © 2019 Author(s).
Access: info:eu-repo/semantics/openAccess
SCOPUS ID: 85076627352
PURE ID: 11756574
ISSN: 0094243X
ISBN: 9780735419216
DOI: 10.1063/1.5134342
Appears in Collections:Научные публикации, проиндексированные в SCOPUS и WoS CC

Files in This Item:
File Description SizeFormat 
2-s2.0-85076627352.pdf406,22 kBAdobe PDFView/Open

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.