Влияние борной кислоты на структурные характеристики Ni нанотрубок

Abstract

Electrochemical deposition (ECD) has been a primary method of metal plating for nearly 100 years. Its popularity is due to its straightforward design, low cost, uniform results, and successful application to a wide range of metals and substrates. Many factors have been shown to affect the composition, texture, and chemical properties of the resultant deposit. In particular, additives play a complex role in metal deposition. There is a vast body of work on the planar deposition. For instance, boric acid is a common additive found in almost all the transition metal plating solutions, yet its influence on metal nanostructure deposition has not been well studied.In this work, we focus on the impact of additives on the growth of metal nanostructures. Specifically, we investigate the role of boric acid in the ECD of nickel nanotubes (NTs) and nanowires (NWs).