Please use this identifier to cite or link to this item: https://elar.urfu.ru/handle/10995/101548
Title: Modeling of dendrite growth from undercooled nickel melt: Sharp interface model versus enthalpy method
Authors: Kao, A.
Toropova, L. V.
Alexandrov, D. V.
Demange, G.
Galenko, P. K.
Issue Date: 2020
Publisher: Institute of Physics Publishing
Citation: Modeling of dendrite growth from undercooled nickel melt: Sharp interface model versus enthalpy method / A. Kao, L. V. Toropova, D. V. Alexandrov, et al. — DOI 10.1088/1361-648X/ab6aea // Journal of Physics Condensed Matter. — 2020. — Vol. 32. — Iss. 19. — 194002.
Abstract: The dendritic growth of pure materials in undercooled melts is critical to understanding the fundamentals of solidification. This work investigates two new insights, the first is an advanced definition for the two-dimensional stability criterion of dendritic growth and the second is the viability of the enthalpy method as a numerical model. In both cases, the aim is to accurately predict dendritic growth behavior over a wide range of undercooling. An adaptive cell size method is introduced into the enthalpy method to mitigate against 'narrow-band features' that can introduce significant error. By using this technique an excellent agreement is found between the enthalpy method and the analytic theory for solidification of pure nickel. © 2020 IOP Publishing Ltd.
Keywords: ENTHALPY
NICKEL
SOLIDIFICATION
STABILITY CRITERIA
ANALYTIC THEORY
DENDRITE GROWTH
DENDRITIC GROWTH
ENTHALPY METHOD
PURE MATERIALS
PURE NICKELS
SHARP INTERFACE MODEL
UNDERCOOLED MELT
NUMERICAL METHODS
URI: http://elar.urfu.ru/handle/10995/101548
Access: info:eu-repo/semantics/openAccess
SCOPUS ID: 85082110511
WOS ID: 000524300600002
PURE ID: f69c9964-f726-4935-ba6b-24dbc3a5ae42
12421304
ISSN: 9538984
DOI: 10.1088/1361-648X/ab6aea
Sponsorship: This work was supported by the Russian Science Foundation (Grant No. 16-11-10095).
RSCF project card: 16-11-10095
Appears in Collections:Научные публикации ученых УрФУ, проиндексированные в SCOPUS и WoS CC

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